본문바로가기

Product

  • Product
  • 3.5inch

X103

X103

Features

제품특징
제품특징 이미지
  • IntelATOM® X6000E Series Processors
  • TPM2.0onboardsecurity design
  • 1xDDR4SO-DIMMsocket,upto32GB
  • RichI/Oconnectivity:3x2.5GbELAN,4xUSBport , 6x COM
  • Support 1 x HDMI 1.4b, 4K@30Hz and a dual channel 18/24-bits
  • Variety Expansion: 1xM.2B+M Key, 1x M.2 E Key, 1x mPCIeslot
  • LVDS connector, up to 1920 x 1080@60Hz
  • Support dual power input, 12V/24V

Specification

라인업 & 상세스펙
X103
CPU IntelATOM® X6000E series SoCProcessors
CPU Supports • x6211E, dual-core, 1.3GHz, 6W
• x6413E, qual-core, 1.5GHz, 9W (Default)
• x6425E, qual-core, 2.0GHz, 12W
Audio RealtekALC888S
Edge I/Onterface • 3xRJ45connector withLEDs
• 2xUSB 3.2Gen1 (Stacked Type)
• 1 x MIC-in, 1x Line-out
• 2xHDMI1.4boutput
• 2 xUSB 2.0 (Stacked Type)
Graphic & Display • Intel® Gen11 UHD graphics Engines
• 1x HDMI 1.4b, resolution up to 3840x 2160@30Hz
• 1x Dual Channel 18/24-bit LVDS connector, up to 1920x1080@60Hz
MainMemory 1x260-pinDDR4SO-DIMMsocket,upto3200MHzwithnon-ECC, un-bufferedmemoryupto32GB
Onboard LAN 3xRJ45 connector with Intel® i226-IT, 2.5GbE LAN controller
Onboard Internal I/O • COM1~2: RS232/422/485, 9-pin header
• 1x 10-pin header for GPIO, 4x GPI, 4x GPO
• 1x 6-pin header for 2x USB 2.0 ports
• COM3~6: RS232 only, 9-pin header
• 1x 4-pin Smart Fan connector
• 1x 4-pinheader for speaker out, 2.5W amplifier
Expansion • 1xM.2 B+M Key, support 2242/3052
• 1x M.2 E Key 2230 for Wi-FI+BT module
• 1 x mini-PCIeslot (PCIe, USB 2.0, SATA signal)
• 1x SIM socket on board, support B+M KEY, 5G/LTE module
Environment • Operating temperature: -35°C to 80°C
• Storage temperature: -40°C to 85°C
• Relative humidity: 95% (non-condensing)
Power Requirements Support 12V/24V Power Input via 1x 4-pin ATX connector
Dimension 146mm(L)x102mm(W)(5.7"x4.0")
Certification • CE (EN55035 + EN55032)
• FCC Class A (EMI part 15B)
Operating System • Win1064-bit,Win11
• Linu x4.1above